Nermeen Hossam, a principal product manager in DRC Physical Verification at Siemens, introduces Calibre 3DStack—a tool for verifying the complex assembly structures of 2.5D and 3D ICs. Unlike traditional ICs, which are self-contained and verified independently, 3D ICs consist of multiple stacked dies, requiring a holistic approach to verification.
Calibre 3DStack offers a comprehensive solution, enabling fast and accurate assembly-level verification. It ensures physical alignment by validating path centers and spacings between stacked dies, crucial for achieving good ohmic contact and reliable cross-die connections. Additionally, it checks connectivity across different pins, including those connected through passive interposers or package RDLs, and compares to layout netlists to identify opens, shorts, or missing labels.
For parasitic extraction, Calibre 3DStack streamlines the process by generating essential files for PEX tools, facilitating the extraction of coupling capacitance at each interface.
With a proven track record in production environments, Calibre 3DStack simplifies the challenges of physical verification for 3D ICs, ensuring their reliability and performance.