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テクノロジー概要
VX2.6 XSI HyperlynxLineSim for pre-route SI exploration
視聴時間: 約1分
Continuing our leadership in High-density advanced packaging with their VX.2.6 Xpedition platform release.
For more information on Xpedition Substrate Integrator, please click
here.
共有
製品
Xpedition IC Packaging