AresCORE UCIe D2D PHY IP from Alphawave Semi

AresCORE is a market-leading, extremely low-power, low-latency Universal Chiplet Interconnect Express (UCle™) Die-to-Die (D2D)

PHY IP designed for very high bandwidth connections between two die that are on the same package.

The AresCORE PHY IP is configurable to support advanced packaging such as Silicon Interposer, RDL Interposer, Integrated Fanout and Silicon Bridge.