Hierarchical device planning: Navigating 3D IC intricacies with STCO

The relentless demand for higher performance and lower power in cutting-edge applications like AI and data centers has led to an explosion in 3D IC complexity and pin counts. While heterogeneous integration with chiplets offers a modular solution, it also introduces significant challenges in advanced package design. This insightful white paper introduces hierarchical device planning (HDP), a critical methodology engineered to break down these overwhelming design challenges into manageable segments.

Discover how HDP integrates established hierarchical design techniques into advanced IC packaging, enabling more robust, flexible, and cost-effective system technology co-optimization (STCO) by shifting critical analyses to earlier design stages. Download this paper to learn how to streamline your 3D IC design processes and achieve optimal results.

What you will learn:

• Understand how to tackle the escalating complexity and massive pin counts inherent in modern 3D IC designs.
• Explore the critical role of HDP in enabling robust and flexible STCO.
• Learn strategies for performing early multi-domain analyses (including signal integrity, power integrity, thermal, and mechanical stress) to guide design decisions and avoid costly redesigns.
• Discover how parametric capabilities within HDP can significantly speed up package prototyping, analysis, and iteration cycles.
• Gain insights into cutting-edge methodologies, tools, and emerging standards that are vital for successful heterogeneous integration.
• See how Siemens' Innovator3D IC solution suite supports an integrated and efficient approach to 3D IC design.