Enabling the ecosystem of true heterogeneous 3D IC designs
In today's semiconductor landscape, the game-changing shift to 3D IC design is becoming a necessity in mainstream design. While industry giants race to overcome the limitations of traditional chip design, a new frontier of heterogeneous integration is unleashing unprecedented possibilities for performance and innovation.
But here's the challenge: 3D IC design isn't simply an upgrade to existing methods. It demands a complete reimagining of how we approach chip design, integration, and manufacturing. Companies that master this transition will lead the next wave of semiconductor innovation; those who don't risk being left behind.
The 3DKs: 3D IC design enablement
The foundation of successful 3D IC implementation lies in a comprehensive suite of design enablement kits that revolutionize how we approach heterogeneous integration. These 3DKs (3D IC chiplet design kits) —spanning chiplet design, package assembly, materials, and testing—form an interconnected ecosystem that streamlines the entire design-to-manufacturing process. By providing standardized yet flexible frameworks, these 3DKs enable designers to navigate complex multi-vendor scenarios while ensuring manufacturability and performance optimization. The result is a dramatic reduction in design cycles and a clear path to first-time-right manufacturing.
To fully leverage the power of 3DKs, robust authoring tools are essential. These next-generation tools transform complex design specifications into machine-readable formats, enabling seamless integration across the supply chain. With built-in validation capabilities and standardized exchange protocols, they ensure consistency and accuracy throughout the design process. Most importantly, they create a foundation for a true chiplet marketplace, where pre-validated designs can be confidently shared and integrated, accelerating innovation while reducing development costs.
This white paper reveals the critical workflows, ecosystem developments, and breakthrough 3DKs that are making heterogeneous integration accessible and practical. Discover how industry leaders are navigating this transformation and positioning themselves for success in the new era of semiconductor design.
Download the white paper now!