Comprehensive die-to-system thermal management solutions for advanced 3D IC packaging

The semiconductor industry’s rapid advancement toward complex 2.5D and 3D IC packages has created unprecedented thermal management challenges that demand sophisticated solutions spanning from die-level to system-level analysis. Siemens addresses these multifaceted challenges through an integrated suite of tools and methodologies that combine advanced thermal modeling, and robust validation methods including precise measurement capabilities. This comprehensive approach enables design teams to identify and mitigate thermal issues early in the design process, while optimizing thermal performance across all integration levels to ensure reliable operation of complex, chiplet-based multi-die packages.