Watch this Keynote presentation given at the Design Automation Conference in San Francisco (DAC) by AJ Incorvaia, Senior Vice President responsible for the Electronic Board Systems Group within Siemens EDA.
In this keynote, AJ will discuss an exciting new technology called Innovator3D IC, which is engineered to deliver the fastest and most predictable path for the prototype planning and heterogeneous integration of chiplets using the latest semiconductor packaging technologies.
Innovator3D IC is the cockpit that drives the Siemens 3D IC technology portfolio, whether it is from initial device architecture planning through detailed implementation, analysis, verification, sign off and all the way into manufacturing.