eBook

3D IC Podcast episode 15 insights: The Siemens SI-PI approach: From feasibility to final closure in 3D IC design

Deliver 3D IC innovations faster

How do you ensure clean, stable power and reliable signal transmission in a dense 3D IC stack without introducing late-stage surprises? The evolving demands of signal integrity and power integrity (SI-PI) in 3D IC architecture, is critical from early planning through to vendor-specific IP verification. Multidisciplinary teams - spanning layout, thermal, mechanical, electrical, and packaging - must align and collaborate in parallel to make next-gen designs successful.

Download this eBook to gain expert insights from the 2025 Siemens EDA 3D IC podcast episode featuring John Caka, Principal SI-PI Engineer at Siemens EDA. It explores why SI-PI analysis are more vital than ever in 3D IC workflows and why progressive verification is key to managing complexity at every stage of design. This eBook also shares insight into Siemens' recent collaboration with Chiplets, highlighting the EDA tool flexibility and scalability needed for today's massive pin-count designs.

Key insights discussed

  • The current state of 3D IC integration
  • Understanding true 3D vs 2.5D integration
  • The economic drivers of 3D IC adoption
  • Technical drivers and tipping points
  • Future outlook: Methodology and mindset changes

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