How to overcome flex and flex-rigid design challenges
Xpedition® guides designers through the minefield of challenges towards first-turn success by providing all the tools needed for successful flex and flex-rigid design and signal integrity analysis.
Flex-rigid PCB design challenges
Multiple board outlines, each with separate layer stack-ups
Special layer stack-up constructs that are unique to flex
Special layer types, such as Adhesive, Cover layer, and Stiffener
Bending and folding of the assembly
The 3D aspect of the folded assembly
The need to route along curving boards without causing reliability issues due to metal stress
Plane and shape fills that conform to flex requirements
Design Rule Checking (DRC) that understands specific flex-rigid rules
Signal and Power integrity of a multi stack-up board
Flex fabrication output that safely conveys design intent to FAB
How Xpedition solves the problems
Xpedition gives you the solution that:
makes it easy to set up simple and complex flex and flex-rigid designs
it's safe and easy to implement changes to stack-up and outlines
supports true 3D design and verification
delivers robust non-ambiguous fabrication output
Learn more about Rigid-flex PCB design.