Part 3: Next Generation IC Packaging Requires Next Generation Design Solution

This is the third in a four-paper series that discusses why the latest emerging advanced IC packaging technologies require a new approach to the entire design flow — all the way from early assembly planning and prototyping through to design creation, verification, validation, signoff, and test. These papers introduce the concept of a digital twin: a digital virtual model of the complete package design that enables cross-domain collaborative design at every design stage.

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