Reduce 3D IC design complexity with early package assembly verification
What you'll learn:
Overcome the distinct challenges of 3DIC design and verification
Reduce debugging efforts by identifying and addressing issues earlier in the design flow
Utilize the power of post-assembly netlist generation for comprehensive verification
Ensure design integrity with multi-physics analysis
Automate the integration of design-specific data for efficiency and accuracy
“Leading semiconductor companies are already successfully leveraging Calibre Shift left solutions for 2.5D and 3DIC design to decrease design iterations and get to market faster.”-- John Ferguson, author
Who should read this:
Chiplet designers seeking to enhance chiplet integration and performance
Package layout designers aiming to optimize 3DIC layouts
IC and SoC designers interested in the latest advancements in semiconductor design
Thermal mechanical engineers focused on addressing stress and temperature concerns in 3DICs