Semiconductor packaging: making the right connections in 3D IC design

In advanced heterogeneous semiconductor packaging, the term substrate represents the range of interconnect materials used to connect various semiconductors and discrete devices. Once the architecture is defined, designers decide and implement the desired connectivity - regardless of the substrate's interconnect technology.

With the novelty and complexity, managing the connectivity can be challenging. Engineering teams must decide when to address it: early in the substrate design process, during connectivity definition, or late in the design cycle during verification

Learn about the 3D IC design workflows available to designers in this ebook.

Advanced heterogeneous semiconductor packaging for 2.5D and 3D IC

One of the critical challenges in 3D IC designs and semiconductor packaging is the disparate format of data sources. Chiplets further exacerbate the data problem as data from multiple sources is unlikely to be available in a single standard format.

Design teams need a planning tool that manages the disparate data as. Quickly and accurately aggregating data formats into a single cohesive system representation and netlist is essential for successful 3D IC design.

Five Key Parts that Drive Successful 2.5D and 3D IC Design Flows

Learn about making the right connections in 3D IC design in this five-part ebook:

1. The Siemens connectivity management solution
2. Planning for transformation
3. Substrate and interposer layout
4. Physical verification
5. Shifting left assembly verification with the digital thread

Download the ebook now!