Breaking the bottleneck: Overcoming the Verification Productivity Gap 2.0

The semiconductor industry is confronting the Verification Productivity Gap 2.0, characterized by the unique complexities and challenges of the latest semiconductor design technologies. Siemens envisions a transformative solution through connected, data-driven, and scalable verification platforms designed to accelerate processes and optimize resource allocation. By integrating AI-driven technologies, we can automate workflows, derive actionable insights, and significantly enhance precision in identifying and resolving bottlenecks. This approach will address cross-design-domain interdependencies, alleviate workforce strain, and ensure more robust, efficient verification.

Smart verification integrates intelligent capabilities to redefine the boundaries of traditional verification. By harnessing cutting-edge technologies, smart verification aims to revolutionize processes, empowering engineering teams to achieve unprecedented levels of effectiveness. These AI/IQ-powered solutions not only automate and scale verification but also drive insightful data analysis, simplify debugging and enable engineering teams to master complex, software-centric architectures with unparalleled agility.

Breaking the bottleneck of the Verification Productivity Gap 2.0 is not just an operational necessity but a strategic imperative. By defining clear success metrics, implementing a structured roadmap, and maintaining a visionary outlook, the semiconductor industry can overcome current challenges and pave the way for sustained innovation and competitiveness. Advanced automation and AI solutions are essential transformations for accelerating time-to-market and ensuring long-term success.