SSN implementation on a large multi-die SoC

At the 2021 International Test Conference, Dave Dehnert, Principal Engineer at Intel, presented his team's experience implementing the Tessent Streaming Scan Network packetized test solution on a large multi-die design.

Intel's success with Tessent Streaming Scan Network packetized test

Intel’s Devices Development Group described their SSN implementation on
a multi-die design, in which different die using different test fabrics share
the same IO. Two of the die used Tessent SSN and the other two used a custom test
fabric. This approach allows them to phase in SSN over time.

This video shows that the implementation was straightforward, requiring no more effort
than their custom fabrics. They report seeing over 2X efficiency gains with pattern retargeting and testing multiple cores in parallel. SSN is able to automatically tune the bandwidth.