Shift left with Calibre 3DThermal

Calibre has a long history of usage in the design and verification of ICs. Now, with the promise of stacked die in a package, Calibre is moving into the 3D arena. The Calibre 3DThermal chip-package level thermal analysis solution addresses the need to analyze, verify and debug thermal effects in 3D ICs from early-stage chip/package exploration to design signoff.

In this video recorded at the 2024 Design Automation Conference, you will hear John Ferguson, Director of Product Management at Siemens EDA, introduce the Calibre 3DThermal solution.

• The opportunity and challenges of 3D ICs
• Why we need thermal analysis in 3D ICs
• How thermal analysis fits into a multiphysics verification solution
• How a shift left strategy reduces cycle time and improves design quality
• How Calibre 3DThermal works for accurate and fast die-level thermal analysis