Using Blind and Buried Vias to Address PCB Design Density and Reliability
Tiempo estimado de visualización: 6 minutos
Learn how PADS Professional enables you to quickly and efficiently optimize routing channels by simplifying the use of blind and buried via technologies which in turn reduce the PCB size, layer count, and cost.
Learn how to leverage product and manufacturing information to effectively gain
intelligence to help organizations gain a competitive advantage across the
entire value chain.