Xpedition Substrate Integrator

Xpedition® Substrate Integrator (xSI) provides a graphical, rapid virtual prototyping environment tuned for the exploration and integration of multiple heterogeneous ICs/chiplets and interposers into High Density Advanced Packages (HDAP).

Key benefits of substrate integrator

• Rapid planning, prototyping and optimization of 2.5/3D heterogeneously integrated die/chiplets based semiconductor package assemblies
• System connectivity management and visualization with cross-domain pin/signal mapping/shorting and system-level logical verification
• User-definable rules for custom optimization of pin and ball-out assignments
• Single-window visualization and hierarchical management of multi- die/chiplet and substrate assemblies
• Pin-based interface planning with or without nets
• Extensive input and output data formats
• System-level LVS/STA verification through Calibre® 3DSTACK
• Integration with Xpedition Package Designer and Calibre, for detailed implementation, verification, and signoff