ficha técnica
Xpedition IC Packaging VX.2.12 Fact Sheet
Tiempo de lectura: 2 minutos
In this paper, you will learn about the key capabilities in the Xpedition IC Packaging VX.2.12 release. You will learn about greater workflow customization through additional automation, optimized ground return paths, simulation and analysis results import, ASIC/chiplet/interposer connectivity modeling, and 100+Gbit differential signal performance.