ficha técnica
HyperLynx Fast 3D solver
Tiempo de lectura: 2 minutos
Designers of chip interfaces, redistribution layers, packages, boards, systems, and SiP, can rapidly and accurately extract SPICE models using the fully automated environment. The solver is ideally suited for power integrity, low-frequency SSN/SSO, and complete-system SPICE model creation while accounting for skin effect impact on resistance and inductance.