Siemens semiconductor package design, simulation, and test workshop

Registration for this event has closed.

Thank you for joining our technical experts at the first Siemens semiconductor package design, simulation, and test workshop!

Topics covered: The latest trends in 2.5D/3D heterogenous packaging, heterogenous package floorplanning and design, package and board-level thermal and structural simulations, testing the thermal performance of package assemblies and thermal interface material selection for packaging applications.

Feel free to reach out with any questions following the event by completing the form below.