white paper

Combine PCB data and shop-floor data to improve the solder paste printing process

Reading time: 20 minutes
Digital image of integrated circuit (IC) on printed circuit board (PCB) with wireframing

Data collected from the shop-floor drives the MES operation and the material flow. However, the value of this data does not stop there.

Digitalization of the operation enables analysis and understanding of what is happening in the factory, why it is happening, how to improve, and finally how to avoid it.

Although the amount of data generated by manufacturing operations is increasing exponentially, only a small portion of it actually gets collected, and an even smaller portion is analyzed in the electronics industry.

In the use case presented here, we will demonstrate how manufacturers can benefit from collecting this data and applying analytics.


Share

Related resources

Multi-board electronic systems design with Xpedition
White Paper

Multi-board electronic systems design with Xpedition

Siemens offers a solution that brings integration, automation, and power to multi-board systems design, as an integral part of the Xpedition® design flow.

How Xpedition enables efficient multi-board systems design
Technology Overview

How Xpedition enables efficient multi-board systems design

Learn how Xpedition handles multi-board definition and partitioning, connector management, system level signal integrity analysis and verification in this video.