white paper
System-level connectivity management and verification of 3D IC heterogeneous assemblies
Reading time: 10 minutes
Designers need an EDA platform such as Xpedition Substrate Integrator (xSI) that can aggregate the different formats for a multi-substrate system and generate a system-level netlist that drives assembly verification. Assembly verification using Xpedition Substrate Integrator and Calibre 3DSTACK is a “designer-centric” approach, as it is agnostic to the different die technology nodes and substrate manufacturers.
To learn more read part 2 "Managing system level netlist challenges for 3D IC assemblies in advanced package designs".