Successful 3D IC design, verification, and analysis requires an integrated approach
Multi-tool solution for chiplet design analysis and physical verification across a heterogeneous 3D IC assembly
Siemens EDA provides multiple 3D IC design analysis and verification functionalities that address the diverse needs of 3D IC design teams, from planning and prototyping to both horizontal and vertical design integration, design rule checking (DRC) and layout vs. schematic (LVS) physical verification, parasitic extraction for electrostatic discharge (ESD) and latch-up (LUP) protection verification, cross-die-aware fill insertion, power domain analysis, thermal analysis, and stress analysis. The capture of design-specific information, such as the layer mapping and placement information for each chiplet, forms the basis for this integrated approach, enabling designers to iterate analysis at varying levels of detail throughout the 3D IC assembly process.