Next generation in high density advanced packaging
High Density Advanced Packaging, or HDAP, is the next-generation architecture for increased functional density, higher performance, lower power, smaller PCB footprints, and thinner profiles. This new “breed” of disruptive packaging technology includes: FOWLP, interposer-based packages (2.5D), CoWoS, high pin-count flip chip, and Wafer-on-Wafer. These new solutions present unique challenges to traditional design tools, are highly disruptive to traditional design methodologies, and disorder the supply chain.
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