white paper

Siemens' cloud-ready Analog FastSPICE platform on AWS accelerates SoC verification

Room with servers

Driven by the explosion of big data and expanding applications, chip design complexity is increasing. Applications such as high-performance computing (HPC), the Internet of Things (IoT), automotive and 5G mobile communications coupled with advanced process technology nodes, require running a large number of circuit simulations to ensure the circuits function correctly. This means even more simulation runtime and the requirement for more compute resources. On-premises compute capacity has undeniably become a bottleneck. Cloud computing is a viable solution to drastically reduce simulation runtime for circuit simulation workflow. In collaboration with Amazon Web Services (AWS), Siemens EDA has made a cloud-ready Analog FastSPICE (AFS) platform available to accelerate design innovation.

Share

Related resources

Heterogeneous Design Methods for 3D IC
Webinar

Heterogeneous Design Methods for 3D IC

Tony Mastroianni talks about 3D IC HI workflows

Heterogeneous Integration of Chiplets Using 3D IC
Webinar

Heterogeneous Integration of Chiplets Using 3D IC

Consider heterogeneous integration to optimize your 3D IC designs. IC packaging design workflows can benefit from the emerging chiplet ecosystem.

System-in-Package Technology: Cost-Effective Heterogeneous Integration
White Paper

System-in-Package Technology: Cost-Effective Heterogeneous Integration

Coordinated planning during the early stages of silicon floor-planning, before elements within the chip are fixed,