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Reliability verification in 3D IC designs

Diagram of a 3D IC construction showing stacked die on a package substrate, connected by through-silicon vias and microbumps
3D IC design issues can be difficult to assess and fix with physical and circuit verification originally designed for 2D layouts. Advanced reliability verification functionalities enable 3D IC designers to accurately identify, analyze, and fix complex layout issues in 3D IC packages that impact design reliability and performance, such as electrostatic discharge (ESD) protection, latch-up prevention, and candidate hot junction detection.

3D IC reliability verification addresses complex design issues like ESD protection, latch-up prevention, and candidate hot junction detection

Reliability verification in 2.5D/3D ICs is significantly more difficult than for 2D ICs, because 2.5D/3D ICs are not just a group of independent 2D ICs connected together. From a reliability verification perspective, designers must be able to propagate verification across multiple dies. For example, ESD protection devices can span multiple dies, and must be combined for correct evaluation. Proven reliability verification methodologies are available to address three critical 2.5/3D IC reliability issues: ESD protection, advanced latch-up DRC, and candidate hot junctions detection. Implementing these methodologies using an automated reliability verification solution like the Calibre® PERC™ reliability platform ensures accurate and consistent reliability verification for 2.5D/3D IC designs.

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