Reliability verification in 3D IC designs
3D IC reliability verification addresses complex design issues like ESD protection, latch-up prevention, and candidate hot junction detection
Reliability verification in 2.5D/3D ICs is significantly more difficult than for 2D ICs, because 2.5D/3D ICs are not just a group of independent 2D ICs connected together. From a reliability verification perspective, designers must be able to propagate verification across multiple dies. For example, ESD protection devices can span multiple dies, and must be combined for correct evaluation. Proven reliability verification methodologies are available to address three critical 2.5/3D IC reliability issues: ESD protection, advanced latch-up DRC, and candidate hot junctions detection. Implementing these methodologies using an automated reliability verification solution like the CalibreĀ® PERCā¢ reliability platform ensures accurate and consistent reliability verification for 2.5D/3D IC designs.