Understand typical design challenges experienced by a power modules designer
This paper provides a technology overview and guides you through the typical design challenges experienced by a power modules designer. It proposes a design and verification methodology, available today, to reduce the number of prototypes, reduce the time to market, and increase power module quality and reliability. All of this can help ensure differentiation from your competition. Download this paper to dive deeper into:
Device technology overview: The challenge for a power module designer is to pick the best technology based on the given product requirements, like electrical performance, thermal performance, cost, and form factor. For this reason, a design flow is required where devices and technologies can be exchanged easily.
Substrate technology overview: The substrate also plays an important role in achieving electrical and thermal performance. This paper concentrates on two materials: Al2O3 and Si3N4.
Stray inductance: Stray inductance in power modules has a huge impact on switching characteristics, such as switching speed, switching loss and voltage overshoot.
Current density: The current density is an important design criterion to reduce joule heating and avoid unwanted material transport mechanisms, like electromigration of conductors such as aluminum.
Cooling: Power modules are available in a wide power range, from small devices with a couple of watts to single kilowatts to large high-power devices up to the megawatt range. Even with a high efficiency of more than 99% cooling, heat transfer is significant.
State-of-the-art design process: Designing a power module is challenging and a designer needs to pick the best device technology, substrate materials, components placement, and copper and wire bond placement, etc., to achieve all requirements for the electrical, EMC, and thermal behavior.