Advanced packages bring new challenges
For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, reduced overall package size, and heterogeneous integration. It is also very different from traditional flipchip organic BGA packaging and, as such, needs a very different approach for design and verification at all levels, starting with the use of a digital twin virtual prototype model that drives all aspects of design and verification, even if different design tools are used.
The second paper in this series, part 2, focuses on the multi-domain and cross-domain integration that the digital twin methodology enables.
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