Catapult High-Level Synthesis resource library

Be it deep learning, computer vision, communications, video, or countless other spaces, Catapult is more than just “C to RTL”. ASIC, FPGA or eFPGA, with novel code/functional coverage, class-leading power opt, and formal verification, learn how it enables you to do more, and do it better.

New resources

Success stories

Heterogeneous Integration of Chiplets Using 3D IC
Webinar

Heterogeneous Integration of Chiplets Using 3D IC

Consider heterogeneous integration to optimize your 3D IC designs. IC packaging design workflows can benefit from the emerging chiplet ecosystem.

Five key workflows for 3D IC packaging success
White Paper

Five key workflows for 3D IC packaging success

Learn about five workflow focus areas to adopt that provide immediate heterogeneous integration capability benefits needed for mainstream 2.5D and 3D IC chiplet design

White papers

Heterogeneous Integration of Chiplets Using 3D IC
Webinar

Heterogeneous Integration of Chiplets Using 3D IC

Consider heterogeneous integration to optimize your 3D IC designs. IC packaging design workflows can benefit from the emerging chiplet ecosystem.

Five key workflows for 3D IC packaging success
White Paper

Five key workflows for 3D IC packaging success

Learn about five workflow focus areas to adopt that provide immediate heterogeneous integration capability benefits needed for mainstream 2.5D and 3D IC chiplet design

Podcasts

Heterogeneous Integration of Chiplets Using 3D IC
Webinar

Heterogeneous Integration of Chiplets Using 3D IC

Consider heterogeneous integration to optimize your 3D IC designs. IC packaging design workflows can benefit from the emerging chiplet ecosystem.

Five key workflows for 3D IC packaging success
White Paper

Five key workflows for 3D IC packaging success

Learn about five workflow focus areas to adopt that provide immediate heterogeneous integration capability benefits needed for mainstream 2.5D and 3D IC chiplet design

Training

Demos and seminars

Documentation and reference designs

Heterogeneous Integration of Chiplets Using 3D IC
Webinar

Heterogeneous Integration of Chiplets Using 3D IC

Consider heterogeneous integration to optimize your 3D IC designs. IC packaging design workflows can benefit from the emerging chiplet ecosystem.

Five key workflows for 3D IC packaging success
White Paper

Five key workflows for 3D IC packaging success

Learn about five workflow focus areas to adopt that provide immediate heterogeneous integration capability benefits needed for mainstream 2.5D and 3D IC chiplet design

Webinars

Heterogeneous Integration of Chiplets Using 3D IC
Webinar

Heterogeneous Integration of Chiplets Using 3D IC

Consider heterogeneous integration to optimize your 3D IC designs. IC packaging design workflows can benefit from the emerging chiplet ecosystem.

Five key workflows for 3D IC packaging success
White Paper

Five key workflows for 3D IC packaging success

Learn about five workflow focus areas to adopt that provide immediate heterogeneous integration capability benefits needed for mainstream 2.5D and 3D IC chiplet design