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eSilicon tackles the challenges of advanced IC package design using Xpedition Substrate Integrator and Calibre 3DSTACK

eSilicon tackles the challenges of advanced IC package design using Xpedition Substrate Integrator and Calibre 3DSTACK
eSilicon (San Jose) designs advanced packages for some of the industry's most complex ICs. They switched from a home-built tool to Xpedition Substrate Integrator (xSI) and Calibre SDSTACK for advanced 2.5D IC package design.

Who is eSilicon?

eSilicon, a pioneering fabless semiconductor company based in San Jose California, recently selected Xpedition® Substrate Integrator from Siemens Digital Industries Software to help improve their package design flow. Founded in 2000, eSilicon had previously used an inhouse developed spreadsheet as their package planning tool. Until late 2016, this spreadsheet, known as PLOC, had met their needs. However, with the increased demands of 2.5D packaging technology, a more advanced, more integrated solution was required that would include digital prototyping capabilities for verification, validation and sign-off.

Why does eSilicon choose xSI to support with their IC package design?

  • Replace a limited spreadsheet with a package planning tool capable of handling complex 2.5D and 3D package designs

  • An open solution not tied to any specific vendor’s physical layout tools

  • The ability to extend the tool’s capacities through user defined properties and a robust API

  • Faster time to market, risk mitigation and improved productivity

Learn more about Xpedition Substrate Integrator.

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