Achieve higher accuracy in electronics cooling simulation with measurement and calibration
Often a typical 3D electronics cooling simulation of an electronic system assumes that all power is dissipated in the semiconductor components. In the case of products with high-current power packages or modules, the power dissipation in the electrical distribution network has become a significant factor. Power dissipation in the copper traces and connections can be in the range of 30 percent of total input power, so it is essential to consider this heating effect in the simulation for highest accuracy prediction in complex, power dense electronics.
This whitepaper considers factors for higher accuracy for modeling trace and connection heat dissipation within simulation. It illustrates thermal measurement of an IGBT module using Simcenter T3STER and model calibration in conjunction with thermal simulation in Simcenter Flotherm.