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white paper

Address EMC/EMI and thermal issues in electric vehicles

Reading time: 25 minutes
Electric powertrains (EPTs) create wide-band, high-level electromagnetic interference (EMI) that can compromise susceptible electronic and radiofrequency units in connected vehicles, autonomous driving systems, and infotainment. EMI, electromagnetic compatibility (EMC), and thermal assessments are critical to engineering vehicle electrical systems.

This white paper examines how Siemens' simulation solutions enable engineers to address the complexities of EMI/EMC, thermal challenges, and overall vehicle electrical system engineering.

Implement an integrated modeling approach to analyze EMI/EMC issues

Overcoming EMI/EMC issues in the early design phase of a vehicle becomes one of the most critical technical challenges all automotive manufacturers need to master. Today's EMC engineer needs a dedicated modeling environment to forecast and replicate the EMC behavior of electronic circuits and boards.

Investigate EMI/EMC challenges and thermal design issues

High-power levels in EVs and high-power charging at high currents generate strong electromagnetic fields and high heat losses. These can threaten the safe and reliable operation of electronic components and signal lines used for autonomous driving, V2X connectivity, and other systems. It is essential for electrical engineering to use multiphysics simulation to assess EMC/EMI and thermal performance at the component, system/subsystem, and full-vehicle levels.

Assess EMC/EMI and thermal performance at all vehicle levels

Assessing EMI/EMC and thermal issues is critical to the reliable and safe operation of low-voltage networks with potentially susceptible electronic and radio-frequency units in parallel with high-voltage drive systems. As a result, there are more stringent EMC regulations concerning commercial products. So, engineers must consider the components and full vehicle levels' electromagnetic and thermal issues.

Download the white paper to learn more about an integrated modeling approach to overcome EMI/EMC issues using multiphysics, multi-domain, and high-fidelity simulations.