Achieving maxwell-accurate electromagnetic integrity in Chip-Package-System design

New challenges and new developments in Chip-Package-System (CPS) design are drastically affecting design methodologies. Whereas chip design has been driven by Moore’s Law for over 50 years, package and system (PCB) design traditionally has evolved at a more sedate pace.

However, packaging is emerging as a significant way to achieve the speed and density necessary for future designs, while reducing power and form factor. Unlike Moore’s Law, this has less to do with the geometric complexity but more with the analysis. It is increasingly necessary to calculate the complex electromagnetic fields to be able to model them accurately. We call this electromagnetic integrity.

This paper examines the technology drivers leading to the need for electromagnetic integrity and explains the methods and techniques used in solving electromagnetic field problems, paying particular attention to how solutions can be accelerated and scaled to meet the increasing demands.