Proven methodologies to meet PDN specifications
The combination of these issues makes meeting manufacturing rules a challenge. Further, the diversity of substrate technologies from numerous vendors means there’s no one-size-fits-all solution. In this paper, we will walk through three methodologies that are commonly utilized on advanced package designs:
Dynamic hatched filled metal areas
Dummy metal fill
These are the most common methods to achieve foundry/OSAT requirements for metal areas and planes in advanced package designs such as interposers, high density-fan-out wafer level package (HDFOWLP), and high pin count flip chip BGAs, so it is important to understand how to use them.
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