Unleashing the future of chip design with Siemens EDA cloud solutions on AWS

As semiconductor designs push the boundaries of leading-edge-nodes, the computational needs for verification, signoff, and design closure are exploding. This session showcases the cloud-ready EDA solutions and proven deployment methodologies enabled by the strategic collaboration between Siemens EDA and Amazon Web Services (AWS).

You’ll learn how Siemens EDA's ‘Cloud Flight Plans’ for Calibre Design, Solido Simulation Suite, Questa One, and Aprisa AI offer best-known methods (BKMs), and reference architectures for quick cloud adoption. We’ll share real-world results demonstrating massive scalability, significant performance gains, and faster turnaround times.

Learn how this partnership delivers business values such as shorter design cycles, unlimited compute capacity, OpEx flexibility, and improved sustainability. Deployment models spanning customer-managed AWS cloud and Siemens-managed cloud, along with support for multiple hardware architectures, will be covered to fit diverse needs.