Advancements in accelerated computing and agentic AI are reshaping semiconductor design, resulting in shorter time to market and increasingly powerful and effective chips. This discussion highlights how AI partners with engineers to dramatically accelerate design timelines, and how accelerated EDA tools enable next-generation designs. The future of design is realized by GPU-accelerated tools driven by powerful EDA AI systems, like Siemens Fuse. While AIs independently drive workflows, using advanced reasoning methods and agent toolkits, accelerated tools unlock new design and simulation capabilities. This shift paves the way for an AI-driven, accelerated future where generative and agentic AI extend today’s EDA processes from basic automation to intelligent, coordinated, and planned execution across every stage of the workflow.
This session presents a vision for the industry: work environments that integrate “faster engines” and “faster engineers”. The AI-driven workflows of the future partner AI with human designers to drive accelerated design tools, test designs, and prepare the final product for manufacturing, driving productivity and innovation to new levels. This talk will spotlight collaborative innovations from NVIDIA and Siemens showcasing how AI acceleration and deep engineering expertise leads to faster tools, smarter workflows, and more resilient engineering teams.