Speedy sign off tiling based on Shift-Left approach (RTC-Fill) - STMicroelectronics

To meet the extremely tight requirements in terms of process control for STI etch and polish, channel length definition as well as Inter-Level Dielectric (ILD) planarization, density requirements must be strictly followed. To achieve this goal, the layout must be made uniform with respect to a certain density parameter. Calibre YieldEnhancer SmartFill exploiting the versatility of the eqDRC feature, automatically creates fillshapes compliant to density constraints. Calibre RealTime Custom (RTC) can simplify the Smart Fill flow from within the Virtuoso design environment. Users can see the tiling result in real time and in advance of the sign-off flow.