IPC launched a design initiative starting in Q2 2023. Amongst a number of projects, a collaboration with Siemens on DFM profiles has been established. In a first step, we focused on utilization of our IPC Standards contents in PCBflow. A series of 9 DFM Profiles based on the IPC Reliability Classes 1,2,3 and the Producability Levels A,B,C have been released end of 2023. Those profiles are now available to all users connecting to IPC in PCBflow, PADS and Xpedition. Therefore an easy way to apply IPC standards conform DFM analysis on Fabrication and Assembly level is available to the entire electronics design and manufacturing industry.