Intel: Systematic PDN analysis for advanced packaging architectures

Traditional power delivery network (PDN) analysis tools inadequately address the distinct challenges of advanced 2.5D/3D packaging, as silicon-centric design environments and package/PCB analysis platforms operate in isolation, creating workflow fragmentation and model inconsistencies.

This paper presents a unified PDN analysis methodology leveraging Siemens EDA software that seamlessly integrates silicon and package-level domains. The approach encompasses DC analysis for voltage regulation, AC decoupling analysis, and end-to-end transient droop analysis, validated through a representative Intel EMIB_T design.