Intel PADK and Reference Flows for EMIB-based Advanced Packaging

An embedded multi-die interconnect bridge (EMIB) is a small silicon bridge embedded inside a package. These dies allow for larger designs that increase the complexity of the design process, which in turn requires a guide to completing a package that can be manufactured. Intel provides a package assembly design kit (PADK) that enables external customers to create EMIB-based package designs. The PADK comprises a design guide, rules, and stack-up that enable a customer to complete and verify an EMIB design efficiently. This PADK enables a reference flow that supports tools from all major EDA vendors. This flow uses industry standard design methodology and vendor agnostic tools, flows, and methods (TFM).

Intel EMIB PADK and Siemens EDA ecosystem help solve EMIB design and verification challenges

EMIB designs are an efficient, cost-effective way to connect multiple dies within a package. However, they come with design challenges that must be addressed to deliver high-quality, manufacturable designs. A PADK is required to help design companies address design complexity and electronic design automation (EDA) tool enablement. The Intel EMIB PADK provides a foundation for an efficient reference flow, and supports co-design that allows early design exploration. A wide range of Siemens EDA tools work with the Intel EMIB PADK to ensure Siemens EDA customers can implement and verify EMIB designs effectively and efficiently.