Escalating design complexity, intense time-to-market pressures, and a shrinking workforce have pushed traditional, isolated design workflows to their limits. Today’s engineers simply cannot manually iterate through multiple design options while ensuring verified, DRC-clean results in shrinking timeframes.
To address this, we showcase how the newly launched Fuse EDA AI System and Fuse EDA AI Agent, which fundamentally transform semiconductor and PCB design by intelligently orchestrating complex, multi-tool workflows from initial concept through manufacturing sign-off. By minimizing manual scripting bottlenecks and seamlessly unifying these processes, the Fuse EDA AI Agent empowers engineering teams to achieve breakthrough productivity and higher-quality designs.
This presentation outlines how EDA AI agents can work individually and collaboratively—using advanced reasoning, multi-tool integration, and data analysis—to enable a fully autonomous end-to-end EDA workflow by leveraging direct API integrations, MCP, and Agent Skills.
We demonstrate this across the complete EDA workflow: (a) C-to-RTL-to-GDS flows generate RTL and deploy PPA optimization agents; (b) custom IC and analog/mixed-signal workflows leverage autonomous setup builders and intelligent debugging with data flywheel approaches for continuous agent refinement; (c) physical verification benefits from intelligent DRC remediation, run optimization, and SVRF deck generation. Each domain showcases how agentic AI eliminates manual intervention while improving outcomes, both in-tool and across the Siemens EDA portfolio: Catapult, Questa One, Aprisa, Veloce, Tessent, Solido, Calibre, Xpedition, and more.
Lastly, we highlight that completing this transformation represents a new design philosophy: one in which engineers and AI agents collaborate as co-designers, each amplifying the other’s strengths across the full EDA workflow.