Fraunhofer: Chiplets in Europe: Trends and challenges

While chiplet technology is often associated with high-performance datacenter applications, many European sectors like automotive, defense, aerospace, and industrial face strict cost and space constraints that demand affordable integration solutions. In these markets, advanced organic interposers are preferred over expensive silicon interposers, providing sufficient electrical performance at lower cost. Similarly, high-end interfaces such as UCIe are often unnecessary; instead, compact and cost-effective interconnect schemes are used to meet area and budget requirements.

This abstract highlights the European perspective on chiplet adoption in these sectors, emphasizing practical, economically viable approaches that balance performance, reliability, and integration density without relying on datacenter-scale technology.