video
Aprisa for TSMC advanced nodes
Customers who plan to design at TSMC’s most advanced nodes can leverage the unique technologies offered by Aprisa, ensuring smooth and successful design projects for all kinds of applications.
This presentation explores the history of the Siemens/TSMC collaboration and introduces the unique Aprisa place-and-route technologies for advanced-node SoC designs.
TSMC – Siemens Collaboration for Customer Success
Presented at the 2022 TSMC Symposium, Inki Hong, Ph.D. general manager of the Siemen's Aprisa place and route group, details the long history of collaboration with TSMC.
Contact Siemens representatives for details www.siemens.com/aprisa