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Unlocking the future of IC packaging design – A 3D InCites award-winning solution

Discover the award-winning solution that's revolutionizing IC packaging and heterogeneous integration. This video celebrates Innovator3D IC, the recipient of the prestigious 3D InCites Technology Enablement Award – a powerful endorsement from industry experts. See how Innovator3D IC empowers designers to conquer the escalating complexities of modern chip design, from managing millions of pins to seamlessly integrating diverse components. Learn about its comprehensive capabilities for early prototyping, planning, optimization, analysis, and verification that streamline workflows and ensure design success. Join us to understand why this award-winning innovation is critical for navigating the fast-evolving electronics landscape and how Siemens is shaping the future of IC design.

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