Boundary scan chain used for 1149.1 or 1149.6 interconnect tests is typical. This video will show usage of boundary scan as compressed or uncompressed chain during ATPG so all the pins of the device under test (DUT) does not need to be contacted.
Thermo-mechanical stresses in heterogeneous 3D IC packages can lead to chip
warpage and circuit behavior. Evaluating and mitigating these issues early is
crucial for quality and reliability of 3D IC designs.