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Build Connectivity Incrementally in Xpedition Substrate Integrator

Estimated Watching Time: 2 minutes
Now package designers can incrementally add connectivity without unassigning or overwriting existing signals in Xpedition Substrate Integrator. This video utilizes the HBM_FOWLP quickstart design available in the VX.2.8 release material to demonstrate how to add power and ground as well as DFT pin assignments to an existing die.

For more information on Xpedition Substrate Integrator, please click here.