Taking 2.5D/3DIC physical verification to the next level
The Calibre 3DSTACK tool helps make 2.5D and 3D IC physical verification faster, more accurate, and easy to use
Siemens EDA support for 2.5/3D IC verification has grown right along with the use of multi-die, multi-chiplet stacked configurations. We enhanced Calibre 3DSTACK checks to ensure more accurate alignment checking between die, and added a precheck mode that enables engineers to catch multiple setup/data issues before invoking signoff runs. Finding and correcting basic implementation mistakes and systemic errors before invoking the Calibre 3DSTACK signoff run eliminates unnecessary debugging iterations and speeds up the overall package verification flow.
In addition, Calibre 3DSTACK integration with the Xpedition Package Designer and Substrate Integrator tools helps speed implementation, while ties to industry-leading parasitic extraction tools enable capture of coupling across die or package interfaces. Extending other traditional IC verification tools, such as reliability verification, to recognize and address package issues empowers design companies to further enhance the market value of their high-density advanced packaging products.