Technical Paper

Customize and standardize your IC verification configuration

Calibre interface tools enable the creation of run configurations in a consistent, easy-to-use visual environment | run configuration setup flow chart

The right mix of rule decks, inputs, variables, and operating conditions ensures designers optimize the accuracy and performance of their signoff verification flows. Creating a configuration setup manually is time-consuming and error-prone. To increase designer productivity, EDA companies developed interface tools that enable design teams to quickly and accurately set up methodologies that are automated, repeatable solutions integrated into their design and verification tools.

Optimizing signoff physical verification run configurations with Calibre interfaces

Considering the number of Calibre verification runs designers launch in a tapeout cycle, even modest gains in efficiency can represent significant gains in productivity. By enabling the creation of run configurations in a consistent, easy-to-use visual environment, Calibre interface tools eliminate multiple time-intensive manual tasks, freeing up more time for designers to focus on meeting design goals and tapeout schedules. The Calibre toolsuite provides several interface tools, including the Calibre Interactive invocation GUI, the Calibre RVE results viewer, and the Calibre DESIGNrev chip finishing interface, that enable designers to manage these tasks easily and accurately.

Share

Related resources

Thermo-mechanical stress on active chiplets in a 3D IC heterogeneous package assembly
Technical Paper

Thermo-mechanical stress on active chiplets in a 3D IC heterogeneous package assembly

Thermo-mechanical stresses in heterogeneous 3D IC packages can lead to chip warpage and circuit behavior. Evaluating and mitigating these issues early is crucial for quality and reliability of 3D IC designs.

Comprehensive die-to-system thermal management solutions for advanced 3D IC packaging
White Paper

Comprehensive die-to-system thermal management solutions for advanced 3D IC packaging

In this white paper you will discover how Siemens addresses thermal management challenges in complex 2.5D and 3D IC packages.

Solving inter-domain leakage challenges: Enhancing IC design with Insight Analyzer
Blog Post

Solving inter-domain leakage challenges: Enhancing IC design with Insight Analyzer

By Charlie Olson Design reliability remains a top priority for engineers in the world of semiconductor technology. One critical challenge…