Multi-patterning makes IC design and manufacture possible at advanced nodes. However, the complexity of the process, and the potential costs of failure, speak to the need for a clear understanding of the process and its limitations. Eliminating any misconceptions and assumptions surrounding the decomposition of layouts is a necessary step in the effective and efficient use of multi-patterning technology.
Many designers think of multi-patterning decomposition and coloring checks as similar to design rule checking. In fact, it operates much more like place and route or dummy fill, with many legal solutions. UnderstandÂing how and why multi-patterning works can help you understand and eliminate the MP issues you encounter in your layouts. We review some fundamental concepts of litho-etch double, triple and quadruple patterning strategies, and how we might all consider changing our expectations based on these concepts.